Indium Thermal Interface Pad - alternative to thermal grease
Pure Indium thermal pad, 100 microns thin, is a high performance, clean alternative to thermal pastes for mating a heat sink to a Peltier chip. For this to work well, it is important to apply force to keep the parts firmly together. Allows for an excellent clean design with mess-free disassembly.
Update: 40*40mm pads are now also available in 75 and 50 micron thicknesses. Thinner pads improve heat transfer, but could be more challenging to work with and may not be as suitable if mating uneven surfaces - our recommendation is to try different sizes before buying larger quantities to experiment which thickness works best for your needs.
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